Evaluation of employee exposure to organic tin compounds used as stabilizers at PVC processing facilities
Contenido multimedia no disponible por derechos de autor o por acceso restringido. Contacte con la institución para más información.
| Tag | 1 | 2 | Value |
|---|---|---|---|
| LDR | 00000nab a2200000 i 4500 | ||
| 001 | MAP20071506651 | ||
| 003 | MAP | ||
| 005 | 20080418125205.0 | ||
| 007 | hzruuu---uuuu | ||
| 008 | 050426e20050101usa|||| | |00010|eng d | ||
| 035 | $a6800013568 | ||
| 040 | $aMAP$bspa | ||
| 084 | $a872 | ||
| 100 | 1 | $0MAPA20080092009$aBoraiko, Carol | |
| 245 | 1 | 0 | $aEvaluation of employee exposure to organic tin compounds used as stabilizers at PVC processing facilities$cCarol Boraiko and John Batt |
| 520 | 8 | $aOrganic tin compounds are primary substances used as heat stabilizers by the polyvinyl chloride (PVC) industry. The use of these compounds in the PVC industry is generally well controlled, usually by automated processes. This study was conducted to provide an overview of worker exposure to organic tin compounds at PVC processing facilities and to verify that these exposure are below the threshold limit value (TLV) set by the American Conference of Governmental Industrial Hygienists for arganic tin | |
| 650 | 1 | 1 | $0MAPA20080585679$aHigiene industrial |
| 650 | 0 | 1 | $0MAPA20080605278$aContaminantes químicos |
| 650 | 0 | 1 | $0MAPA20080570484$aRiesgo laboral |
| 650 | 0 | 1 | $0MAPA20080536886$aPVC |
| 650 | 1 | 1 | $0MAPA20080625054$aSustancias tóxicas y peligrosas |
| 650 | 1 | 1 | $0MAPA20080568863$aEstados Unidos |
| 650 | 1 | 1 | $0MAPA20080540937$aEstaño |
| 700 | 1 | $0MAPA20080008840$aBatt, John | |
| 710 | 2 | $0MAPA20080460990$aAmerican Industrial Hygiene Association | |
| 710 | 2 | $0MAPA20080474805$aAmerican Conference of Governmental Industrial Hygienists | |
| 773 | 0 | $tJournal of occupational and environmental hygiene$dCincinnati, Ohio : American Industrial Hygiene Association : American Conference of Governmental Industrial Hygienists$gVol. 2, nº 2, January 2005 ; p. 73-76 |